S.-K. Hsu, J.-C.Yen, and T.-L. Wu, “A novel microstrip forward directional coupler using defected ground structure,” in Asia-Pacific Microw. Conf., pp. 794-797, Yokohama, Japan, Dec. 2010
DownloadC.-H. Huang, C.-Y. Hsiao, C.-D Wang, T. Chen, K.-H. Liao, and T.-L. Wu, “Conformal shielding investigation for SiP modules,” in Proc. Elect. Design Adv. Packag. Systems Symp., pp. 1-4, Singapore, Dec. 2010
DownloadH. H. Chuang and T. L. Wu, “A novel ground resonator technique to reduce common-mode radiation on slot-crossing differential signals,” IEEE Trans. Microw. Compon. Lett., vol. 20, no. 12, pp. 660 - 662, Dec. 2010
DownloadY.-H. Hsu, C.-H. Tsai, and T.-L. Wu, “A new bandastop filter uisng artificial defected ground structures with compact size and low radiation,” in Proc. Elect. Performance Electron. Packag. Systems, pp. 89-92, Austin, USA, Oct. 2010
DownloadS.-K. Hsu and T.-L. Wu, “A novel microstrip forward directional coupler based on an artificial substrate,” in Proc. Eur. Microw. Conf., pp. 926-929, Paris, France, Sept. 2010
DownloadC.-D. Wang and T.-L. Wu, “A stopband enhanced EBG power/ground plane based on via location design,” in Proc. IEEE Compon. Packag. Manuf. Technol. Symp. Japan, Tokyo, Japan, Aug. 2010
DownloadH.-H. Chuang and T.-L.Wu, “A new common-mode EMI suppression technique for GHz differential signals crossing slotted reference planes,” in Proc. IEEE. Int. Symp. Electronmagn. Compat., pp. 12-15, Folorida, USA, Jul. 2010
DownloadC.-H. Cheng, C.-H. Tsai, and T.-L. Wu, “A novel time domain method to extract equivalent circuit model of patterned ground structures,” IEEE Trans. Microw. Compon. Lett., vol. 20, no. 9, pp. 486-488, Oct. 2010
DownloadC.-Y. Hsieh, C.-D. Wang, K.-Y. Lin, and T.-L. Wu, “A power bus with multiple via ground surface perturbation lattices for broadband noise isolation: modeling and application in RF-SiP,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 582-591, Aug. 2010
DownloadS.-K. Hsu, C.-H. Tsai, and T.-L. Wu, “A novel miniaturized forward-wave directional coupler with periodical mushroom-shaped ground plane,” IEEE Trans. Microw. Theory Techn., vol. 58, no. 8, pp. 2277-2283, Aug. 2010
DownloadT.-L. Wu, J. Fan, F. d. Paulis, C.-D. Wang, A. C. Scogna, and A. Orlandi, “Mitigation of noise coupling in multilayer high-speed PCB: state of the art modeling methodology and EBG technology,” IEICE Trans. Commun. (Invited paper), vol .E93-B, no. 07, Jul. 2010
DownloadI.-I. A. Ieong, C.-H. Tsai, and T.-L. Wu, “An ultra compact common-mode filter for RF interference control in 3G wireless communication systems,” in Proc. IEEE Int. Symp. Electromagn. Compat., pp. 776-779, Folorida, USA, Jul. 2010
DownloadA. Ciccomancini, T. L. Wu, and A. Orlandi, “Noise coupling mitigation in PWR/GND plane pair by means of photonic crystal fence: sensitivity analysis and design parameters extraction,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 574-581, May 2010
DownloadW.-Y. Huang, T.-K. Wang, and T.-L. Wu, “Design and modelling of miniaturized bandgap structure for wideband GHz-noise suppression based on LTCC technology,” IEEE Trans. Adv. Packag., vol. 33, no. 3, pp. 630-638, May 2010
DownloadT.-L. Wu, H.-H. Chuang, and T.-K. Wang, “Overview of power integrity solutions on package and PCB: decoupling and EBG isolation,” IEEE Trans. Electromagn. Compat. (Invited paper), vol. 52, no. 2, pp. 346-356, May 2010
DownloadH.-H. Chuang, W.-D. Guo, Y.-H. Lin, H.-S. Chen, Y-C Lu, J. Hong, C.-H. Yu, A. Cheng, J. Chou, C.-J. Chang, J. Ku, T.-L. Wu, and R.-B. Wu, “Signal/Power integrity modeling of high-speed memory modules using chip-package-board co-analysis,” IEEE Trans. Electronmagn. Compat., vol. 52, no. 2, pp. 381-391, May 2010
DownloadC.-H. Cheng, C.-H. Tsai, and T.-L. Wu, “A novel time domain method to extract equivalent circuit model of patterned ground structures,” in Asia-Pacific Symp. Electromagn. Compat., pp. 622-626, Beijing, China, Apr. 2010
DownloadA. C. Scogna, C.-D. Wang, A. Orlandi, and T.-L. Wu, “Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure,” in Asia-Pacific Symp. Electromagn. Compat., pp. 158-161, Beijing, China, Apr. 2010
DownloadH.-H. Chuang, C.-J. Hsu, J. Hong, C.-H. Yu, A. Cheng, J. Ku, and T.-L. Wu, “A broadband chip-level power-bus model feasible for power integrity chip-package co-design in high-speed memory circuits,” IEEE Trans. Electromagn. Compat., vol. 52, no. 1, pp. 235-239, Feb. 2010
DownloadG.-Z. Wu, Y.-C. Chen, and T.-L. Wu, “Design and implementation of a novel hybrid photonic crystal power/ground layer for broadband power noise suppression,” IEEE Trans. Adv. Packag., vol. 33, no. 1, pp. 206-211, Feb. 2010
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