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With the trend of high data rate transmission, differential signaling has become essential in high-speed digital system design due to its high immunity to noise and crosstalk and low EMI. Differential signaling transmit signal from one chip to the other chip through package and PCB. The signal may pass through various interconnects, including wire bonds, via transition, bumps, bend, traces crossing slot, connectors, and even the I/O cables. These interconnects will degrade the quality of the transmitted signal, if they are adequately treated and designed. In addition, lossy material, the crosstalk, and power integrity will also influence the signal integrity. Eye diagram is the most efficient way to evaluate the signal integrity. Based on this, our group will provide the different methods to model the imperfect effect from chip level to PCB level and propose solutions for these effects. Furthermore, a design flow is also presented for optimizing the parameters of eye diagram, such us eye height, eye width, and jitter.
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