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Electro Magnetic Compatibility » Research » Power Integrity » Power Integrity on PCB, Package, and Chip Level

Power Integrity on PCB, Package, and Chip Level

Power distribution network (PDN) design has became one of the major concerns in designing high-speed circuits or mixed signal systems in recent few years. The challenge is expected to increase in next decade as electronic systems are driven in the direction of faster digital speed, higher integration with radio frequency circuits, and higher throughput of data communication.

  We are interesting in both the formation mechanism and isolation design of the power noise. However, several solutions, such as decoupling capacitors and power island, for maintaining the power integrity are not sufficient enough. In particular, the electromagnetic bandgap (EBG) technology, which we are also focused on, provides a promising solution to significantly reduce the noise propagation through power distribution network.

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